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Manufacturing Capabilities生產技術能力
| Description | Specification |
| Laminate板材 | FR-4 (Tg140,Tg150, Tg170 等) |
| Halogen Free FR-4, CEM-3, BT |
| G10, High-Temp G10, Telfon, 金屬基材 |
| Surface Finishing表面處理 | Gold Electro Plating電鎳金 |
| Electroless Nickel Immersion Gold (ENIG)沉金/化金 |
| Lead Free H.A.L 無鉛噴錫 |
| OSP 有機助焊保護膜 |
| Immersion Tin/Silver 沉錫、沉銀 |
| Minimum Line Width/Spacing最小線距/線闊 | 0.075mm/0.075mm |
| Minimum Finished Hole Size最小孔徑 | Φ0.20mm (laser drill Φ0.1mm) |
| Thickness of Board板厚 |
|
| Single & Double Side 單雙面 | 0.1~4.0mm |
| Multilayer 多層 | 0.4~4.0mm |
| Maximum Board Size 最大板尺寸 | 546mm ×690mm |
| Gold Thickness鍍金厚度 |
|
| Thick Gold 厚金 | Up to 1um |
| Flash Gold 薄金 | ≧0.025um |
| Low-Stress Nickel Thickness鍍軟鎳厚度 | ≧2.5um |
| Tolerance公差 |
|
| 1.Non Plated-Through Hole非金屬孔徑 | ±0.05mm |
| 2.Plated-Through Hole金屬孔徑 | ±0.08mm |
| 3.Outline外形尺寸 | ±0.10mm |
| Registration Tolerance差距公差 |
|
| 1.Drilled Hole To Drilled Hole電腦數控孔與孔距 | ±0.05mm |
| 2.Drilled Hole To Circuit Pattern電腦數控孔與線路距 | ±0.10mm |
| 3.Drilled Hole To Punched Hole電腦數控孔與啤孔距 | ±0.10mm |
| 4.Drilled Hole To Outline電腦數控孔與外形距 | ±0.10mm |
| (For 1.6mm Thickness of Laminate) |
|